📢 Poster Presentation Program Now Available – Please See the Latest News for Details.    •    📢 Poster Presentation Program Now Available – Please See the Latest News for Details.    •    📢 Poster Presentation Program Now Available – Please See the Latest News for Details.

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Announcement

Poster Presntation Program

The Poster Presentation Competition aims to encourage researchers and students to enhance their scientific communication skills and share their research findings through poster presentations.

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Announcement

Typhoon Notice for ICAPS 2026

Conference arrangements will follow the official announcements of the Taichung City Government.

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Call for Papers

Abstract submission deadline has been extended to July 3, 2026

Abstract submission deadline extended to July 3, 2026.

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Registration

ICAPS 2026 Registration and Payment Notice

ICAPS 2026 registration is now open. Participants are invited to complete registration and submit abstracts through the official website. Registration fee payments are accepted by bank transfer only. Payment information will be provided during the registration process.

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Call for Papers

Call for Papers for ICAPS 2026

We are pleased to announce the 2026 International Conference on Advanced Plasma for Semiconductors (ICAPS 2026). This year’s conference focuses on "Simulation, AI, and Plasma Processing for Semiconductor Manufacturing."

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Announcement

Mark Your Calendars: Key Deadlines for ICAPS 2026

As the 2026 International Conference on Advanced Plasma for Semiconductors (ICAPS 2026) approaches, we would like to kindly remind all prospective authors and participants to note the following important dates for abstract submission and registration.

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Organizer

FIP-SPE@FCU
Fraunhofer ist
FCU IPACDS
Twin E A2

Co-organizers

國家科學及技術委員會補助
香港城市大學
G2C+
c sun志聖
大永真空
長達國際
cLPS
Trumpf
力寶來
德國經貿辦事處(AHK)
臺灣電漿科技協會(TAPST)
TACT
VON ARDENNE
Svc 70 Tile
Deutsches Institut Taipei
清華五校聯盟
逢甲材料
台南大學育成中心
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