Event Details
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Dates: July 8th–9th, 2026
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Venue: International Conference Hall IX, Feng Chia University, Taichung, Taiwan
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Website: icaps.fcu.edu.tw
Topics of Interest
We invite submissions including, but not limited to, the following areas:
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Plasma Science & Diagnostics: Surface interactions, advanced diagnostics, and atmospheric pressure plasma.
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Emerging Plasma for Semiconductor: Next-gen logic & memory, 2D & wide-bandgap materials, and Atomic Layer Processing (ALP).
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Advanced Packaging & Heterogeneous Integration: Dry processes, high-density plasma, hybrid bonding, and 3D IC/chiplet integration.
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Digitalization, AI & Equipment Intelligence: Digital twin, virtual metrology, physics-informed machine learning, and autonomous process control.
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Sustainability & Green Manufacturing: Green plasma etching replacement, energy-efficient sources, and subsystem abatement.
Submission Guidelines
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Format: Poster Only.
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Language: All submissions (including extended abstracts and posters) must be in English.
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Template: Authors must use the ICAPS 2026 Official Template available on the website.
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Submission Method: Please upload your manuscript via the online portal on the official website.
Important Dates
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May 25, 2026: Abstract submission deadline
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June 15, 2026: Early bird registration deadline
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July 8-9, 2026: Conference dates
Contact Information
For further inquiries, please contact:
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Prof. Ping-Yen Hsieh: pyhsieh@o365.fcu.edu.tw
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Mr. Ting-Yu Chang: tyuchang@o365.fcu.edu.tw / +886-4-2451-7250 EXT. 6535