ICAPS 2026
International Conference on Advanced Plasma for Semiconductors
Simulation, AI, and Plasma Processing for Semiconductors Manufacturing
Xue Si Building, Feng Chia University, Taichung, Taiwan
It is our great pleasure to welcome you to the 2026 International Conference on Advanced Plasma for Semiconductors – Simulation & AI and Plasma Processing for Semiconductors Manufacturing , which will be held on July 8–9, 2026, at Feng Chia University in Taichung, Taiwan.
ICAPS 2026 is jointly organized by Feng Chia University (FCU) and Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST), Germany. This conference aims to bring together leading scientists, engineers, and industry experts from around the world to exchange knowledge and insights on cutting-edge plasma technologies for semiconductors manufacturing.
As semiconductor technologies continue to evolve toward higher integration, advanced packaging, and intelligent manufacturing, plasma-based processes play an increasingly critical role. ICAPS 2026 provides a premier platform to explore the latest advancements spanning plasma science, process development, computational modeling, plasma diagnostics, and artificial intelligence.
Beyond the technical sessions, ICAPS 2026 is designed to foster interdisciplinary collaboration and strengthen global partnerships between academia and industry. We sincerely look forward to welcoming you to Taichung, Taiwan for an inspiring and impactful ICAPS 2026.
— Conference Chair, Prof. Ju-Liang He and Dr. Ralf Bandorf
Important Dates
Please note the following key dates for submissions and registration
Latest News
Stay updated with the latest conference news and announcements
ICAPS 2026 Registration and Payment Notice
ICAPS 2026 registration is now open. Participants are invited to complete registration and submit abstracts first. Online payment (ECPay) will be available soon; further details will be announced on the official website.
Abstract submission deadline has been extended to June 26
Abstract submission deadline has been extended to June 26
Call for Papers for ICAPS 2026
We are pleased to announce the 2026 International Conference on Advanced Plasma for Semiconductors (ICAPS 2026). This year’s conference focuses on "Simulation, AI, and Plasma Processing for Semiconductors Manufacturing."
Topics of Interest
Including but not limited to the following research areas
Plasma Science & Diagnostics
- Plasma-Surface Interactions
- Advanced Plasma Diagnostics
- Atmospheric Pressure Plasma
Emerging Plasma for Semiconductor
- Plasma for Next-Gen Logic & Memory
- 2D & Wide-Bandgap Materials
- Atomic Layer Processing (ALP) and Plasma ALP
Advanced Packaging & Heterogeneous Integration
- Dry Processes for Packaging
- High-Density Plasma (HDP) for Packaging
- Plasma for Hybrid Bonding & Surface Activation
- 3D IC & Chiplet Integration
Digitalization, AI & Equipment Intelligence for Plasma Processes
- Digital Twin & Virtual Metrology for Plasma Processes
- Physics-Informed Machine Learning
- Autonomous Process Control
Sustainability & Green Manufacturing for Semiconductor
- Green Plasma Etching Replacement
- Energy-Efficient Plasma Sources
- Subsystem Abatement
Miscellaneous
- All semiconductor and plasma related