ICAPS 2026 123

It is our great pleasure to welcome you to the 2026 International Conference on Advanced Plasma for Semiconductors – Simulation & AI and Plasma Processing for Semiconductors Manufacturing (ICAPS 2026), which will be held on July 8–9, 2026, at Feng Chia University in Taichung, Taiwan.

ICAPS 2026 is jointly organized by Feng Chia University (FCU) and Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST), Germany. This conference aims to bring together leading scientists, engineers, and industry experts from around the world to exchange knowledge and insights on cutting-edge plasma technologies for semiconductors manufacturing.

As semiconductor technologies continue to evolve toward higher integration, advanced packaging, and intelligent manufacturing, plasma-based processes play an increasingly critical role. ICAPS 2026 provides a premier platform to explore the latest advancements spanning plasma science, process development, computational modeling, plasma diagnostics, and artificial intelligence.

Beyond the technical sessions, ICAPS 2026 is designed to foster interdisciplinary collaboration and strengthen global partnerships between academia and industry. We sincerely look forward to welcoming you to Taichung, Taiwan for an inspiring and impactful ICAPS 2026.