ICAPS 2026
International Conference on Advanced Plasma for Semiconductors
Simulation, AI, and Plasma Processing for Semiconductor Manufacturing
Xue Si Building, Feng Chia University, Taichung, Taiwan
It is our great pleasure to welcome you to the 2026 International Conference on Advanced Plasma for Semiconductors – Simulation & AI and Plasma Processing for Semiconductor Manufacturing , which will be held on July 8–9, 2026, at Feng Chia University in Taichung, Taiwan.
ICAPS 2026 is jointly organized by Feng Chia University (FCU) and Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST), Germany. This conference aims to bring together leading scientists, engineers, and industry experts from around the world to exchange knowledge and insights on cutting-edge plasma technologies for semiconductor manufacturing.
As semiconductor technologies continue to evolve toward higher integration, advanced packaging, and intelligent manufacturing, plasma-based processes play an increasingly critical role. ICAPS 2026 provides a premier platform to explore the latest advancements spanning plasma science, process development, computational modeling, plasma diagnostics, and artificial intelligence.
Beyond the technical sessions, ICAPS 2026 is designed to foster interdisciplinary collaboration and strengthen global partnerships between academia and industry. We sincerely look forward to welcoming you to Taichung, Taiwan for an inspiring and impactful ICAPS 2026.
— Conference Chair, Prof. Ju-Liang He and Dr. Ralf Bandorf
Important Dates
Please note the following key dates for submissions and registration
Latest News
Stay updated with the latest conference news and announcements
Poster Presntation Program
The Poster Presentation Competition aims to encourage researchers and students to enhance their scientific communication skills and share their research findings through poster presentations.
Typhoon Notice for ICAPS 2026
Conference arrangements will follow the official announcements of the Taichung City Government.
Abstract submission deadline has been extended to July 3, 2026
Abstract submission deadline extended to July 3, 2026.
Topics of Interest
Including but not limited to the following research areas
Plasma Science & Diagnostics [PS]
- Plasma-Surface Interactions
- Advanced Plasma Diagnostics
- Atmospheric Pressure Plasma
Emerging Plasma for Semiconductor [EP]
- Plasma for Next-Gen Logic & Memory
- 2D & Wide-Bandgap Materials
- Atomic Layer Processing (ALP) and Plasma ALP
Advanced Packaging & Heterogeneous Integration [AP]
- Dry Processes for Packaging
- High-Density Plasma (HDP) for Packaging
- Plasma for Hybrid Bonding & Surface Activation
- 3D IC & Chiplet Integration
Digitalization, AI & Equipment Intelligence for Plasma Processes [DA]
- Digital Twin & Virtual Metrology for Plasma Processes
- Physics-Informed Machine Learning
- Autonomous Process Control
Sustainability & Green Manufacturing for Semiconductor [SG]
- Green Plasma Etching Replacement
- Energy-Efficient Plasma Sources
- Subsystem Abatement
Miscellaneous [Misc]
- All semiconductor and plasma related