🔔 Early bird registration discount ends June 30, 2026! • 🔔 Early bird registration discount ends June 30, 2026! • 🔔 Early bird registration discount ends June 30, 2026!

Abstract Submission

Submit your abstract for ICAPS 2026 — Poster presentation only

Home Abstract Submission

Abstract Submission

The abstract must be written in English.

Please download ABSTRACT TEMPLATE and make sure to submit in PDF file.

All abstracts must be submitted online via the ICAPS 2026 website.

Poster presentation only.

Please select the appropriate program scope when submitting your abstract online.

Topics of Interest

Including but not limited to:

Plasma Science & Diagnostics

Plasma-Surface Interactions
Advanced Plasma Diagnostics
Atmospheric Pressure Plasma

Emerging Plasma for Semiconductor

Plasma for Next-Gen Logic & Memory
2D & Wide-Bandgap Materials
Atomic Layer Processing (ALP) and Plasma ALP

Advanced Packaging & Heterogeneous Integration

Dry Processes for Packaging
High-Density Plasma (HDP) for Packaging
Plasma for Hybrid Bonding & Surface Activation
3D IC & Chiplet Integration

Digitalization, AI & Equipment Intelligence for Plasma Processes

Digital Twin & Virtual Metrology for Plasma Processes
Physics-Informed Machine Learning
Autonomous Process Control

Sustainability & Green Manufacturing for Semiconductor

Green Plasma Etching Replacement
Energy-Efficient Plasma Sources
Subsystem Abatement

Paper Competition Rules

ICAPS 2026 hosts a Student Oral Paper Competition and a Poster Competition. All are welcome to participate.

Poster Competition (Open to All)

Competition Format (Two Stages)

Stage 1: Expert judges score posters on Day 1; top 30% advance to Stage 2.
Stage 2: Finalists announced at noon on Day 2; all attendees vote on-site to determine final rankings.

Outstanding
NT$ 1,500

Excellent
NT$ 1,000

Honorable Mention
NT$ 500

Poster Specifications

Width 75 cm × Height 100 cm, portrait orientation.