Announcement
📅 Important Dates
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Abstract Submission Deadline: May 25, 2026
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Notification of Acceptance: May 31, 2026
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Early-Bird Registration Deadline: June 15, 2026
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Conference Dates: July 8–9, 2026
Submission Quick Facts
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Theme: Simulation, AI, and Plasma Processing for Semiconductors Manufacturing.
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Format: All presentations will be in Poster Only format.
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Language: Submissions must be in English using the official ICAPS 2026 template.
Action Required
Authors are encouraged to submit their manuscripts through the official Online Portal at icaps.fcu.edu.tw before the May 25th deadline to ensure eligibility for review.
For further assistance, please contact the organizing committee at pyhsieh@o365.fcu.edu.tw or tyuchang@o365.fcu.edu.tw.
Venue: International Conference Hall IX, Feng Chia University, Taichung, Taiwan.